Thermal-aware test scheduling using network-on-chip under multiple clock rates
The increasing trend in the number of cores on a single chip has led to scalability and bandwidth issues in bus-based communication. Network-on-chip (NoC) techniques have emerged as a solution that provides a much needed flexibility and scalability in the era of multi-cores. This article presents an...
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| مؤلفون آخرون: | |
| التنسيق: | article |
| منشور في: |
2013
|
| الوصول للمادة أونلاين: | http://hdl.handle.net/10725/3526 http://dx.doi.org/10.1080/00207217.2012.713016 http://www.tandfonline.com/doi/abs/10.1080/00207217.2012.713016 |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|
| الملخص: | The increasing trend in the number of cores on a single chip has led to scalability and bandwidth issues in bus-based communication. Network-on-chip (NoC) techniques have emerged as a solution that provides a much needed flexibility and scalability in the era of multi-cores. This article presents an optimal integer linear programming (ILP) formulation and a simulated annealing (SA) solution to thermal and power-aware test scheduling of cores in an NoC-based SoC using multiple clock rates. The methods have been implemented and results on various benchmarks are presented. |
|---|