A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol
<p dir="ltr">The current study examines thin film flow and heat transfer phenomena with some additional effects such as magnetohydrodynamic, viscous dissipation, and slip condition over unsteady radially stretching surfaces for various shapes of copper (Cu) nanoparticles dispersed in...
محفوظ في:
| المؤلف الرئيسي: | |
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| مؤلفون آخرون: | , , |
| منشور في: |
2023
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| الموضوعات: | |
| الوسوم: |
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| _version_ | 1864513535657115648 |
|---|---|
| author | Umer Hayat (17541777) |
| author2 | Ramzan Ali (17541780) Shakil Shaiq (17541783) Azeem Shahzad (580946) |
| author2_role | author author author |
| author_facet | Umer Hayat (17541777) Ramzan Ali (17541780) Shakil Shaiq (17541783) Azeem Shahzad (580946) |
| author_role | author |
| dc.creator.none.fl_str_mv | Umer Hayat (17541777) Ramzan Ali (17541780) Shakil Shaiq (17541783) Azeem Shahzad (580946) |
| dc.date.none.fl_str_mv | 2023-06-09T03:00:00Z |
| dc.identifier.none.fl_str_mv | 10.1515/rams-2022-0320 |
| dc.relation.none.fl_str_mv | https://figshare.com/articles/journal_contribution/A_numerical_study_on_thin_film_flow_and_heat_transfer_enhancement_for_copper_nanoparticles_dispersed_in_ethylene_glycol/24717381 |
| dc.rights.none.fl_str_mv | CC BY 4.0 info:eu-repo/semantics/openAccess |
| dc.subject.none.fl_str_mv | Chemical sciences Macromolecular and materials chemistry Engineering Fluid mechanics and thermal engineering Physical sciences Condensed matter physics thin film copper nanoparticles unsteady radial stretching surface partial slip shape factors viscous dissipation |
| dc.title.none.fl_str_mv | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| dc.type.none.fl_str_mv | Text Journal contribution info:eu-repo/semantics/publishedVersion text contribution to journal |
| description | <p dir="ltr">The current study examines thin film flow and heat transfer phenomena with some additional effects such as magnetohydrodynamic, viscous dissipation, and slip condition over unsteady radially stretching surfaces for various shapes of copper (Cu) nanoparticles dispersed in ethylene glycol (EG). The effective thermal conductivity of a nanofluid made of Cu nanometer-sized particles distributed in EGEG is significantly higher than that of pure EG. Partial differential equations are transformed into ordinary differential equations using the proper transformations. An effective convergent technique (<i>i.e.</i>, BVP<sub>4</sub>C) is used to compute the solutions of nonlinear systems. MATLAB software is used to perform the calculations. The effect of numerous emerging physical characteristics on temperature and velocity, such as unsteadiness parameter (S), slip parameter (K), Hartmann number (M), solid volume fraction (ϕ), and Eckert number (EC) is investigated and illustrated graphically. The physical quantities, such as the skin friction coefficient and the Nusselt number, are calculated, described, and displayed in tabular form. It is observed that blade-shaped Cu nanoparticles had the lowest surface drag, highest heat transfer rate, and minimum film thickness compared to the brick and cylinder-shaped nanoparticles. According to our detailed investigation blade-shaped Cu nanoparticle is the most suited solution for manufacturing unsteady radially stretching modules.</p><h2>Other Information</h2><p dir="ltr">Published in: Reviews on Advanced Materials Science<br>License: <a href="http://creativecommons.org/licenses/by/4.0" target="_blank">http://creativecommons.org/licenses/by/4.0</a><br>See article on publisher's website: <a href="https://dx.doi.org/10.1515/rams-2022-0320" target="_blank">https://dx.doi.org/10.1515/rams-2022-0320</a></p> |
| eu_rights_str_mv | openAccess |
| id | Manara2_54d81e0c708b60ba7c750372f3794fe7 |
| identifier_str_mv | 10.1515/rams-2022-0320 |
| network_acronym_str | Manara2 |
| network_name_str | Manara2 |
| oai_identifier_str | oai:figshare.com:article/24717381 |
| publishDate | 2023 |
| repository.mail.fl_str_mv | |
| repository.name.fl_str_mv | |
| repository_id_str | |
| rights_invalid_str_mv | CC BY 4.0 |
| spelling | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycolUmer Hayat (17541777)Ramzan Ali (17541780)Shakil Shaiq (17541783)Azeem Shahzad (580946)Chemical sciencesMacromolecular and materials chemistryEngineeringFluid mechanics and thermal engineeringPhysical sciencesCondensed matter physicsthin filmcopper nanoparticlesunsteady radial stretching surfacepartial slipshape factorsviscous dissipation<p dir="ltr">The current study examines thin film flow and heat transfer phenomena with some additional effects such as magnetohydrodynamic, viscous dissipation, and slip condition over unsteady radially stretching surfaces for various shapes of copper (Cu) nanoparticles dispersed in ethylene glycol (EG). The effective thermal conductivity of a nanofluid made of Cu nanometer-sized particles distributed in EGEG is significantly higher than that of pure EG. Partial differential equations are transformed into ordinary differential equations using the proper transformations. An effective convergent technique (<i>i.e.</i>, BVP<sub>4</sub>C) is used to compute the solutions of nonlinear systems. MATLAB software is used to perform the calculations. The effect of numerous emerging physical characteristics on temperature and velocity, such as unsteadiness parameter (S), slip parameter (K), Hartmann number (M), solid volume fraction (ϕ), and Eckert number (EC) is investigated and illustrated graphically. The physical quantities, such as the skin friction coefficient and the Nusselt number, are calculated, described, and displayed in tabular form. It is observed that blade-shaped Cu nanoparticles had the lowest surface drag, highest heat transfer rate, and minimum film thickness compared to the brick and cylinder-shaped nanoparticles. According to our detailed investigation blade-shaped Cu nanoparticle is the most suited solution for manufacturing unsteady radially stretching modules.</p><h2>Other Information</h2><p dir="ltr">Published in: Reviews on Advanced Materials Science<br>License: <a href="http://creativecommons.org/licenses/by/4.0" target="_blank">http://creativecommons.org/licenses/by/4.0</a><br>See article on publisher's website: <a href="https://dx.doi.org/10.1515/rams-2022-0320" target="_blank">https://dx.doi.org/10.1515/rams-2022-0320</a></p>2023-06-09T03:00:00ZTextJournal contributioninfo:eu-repo/semantics/publishedVersiontextcontribution to journal10.1515/rams-2022-0320https://figshare.com/articles/journal_contribution/A_numerical_study_on_thin_film_flow_and_heat_transfer_enhancement_for_copper_nanoparticles_dispersed_in_ethylene_glycol/24717381CC BY 4.0info:eu-repo/semantics/openAccessoai:figshare.com:article/247173812023-06-09T03:00:00Z |
| spellingShingle | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol Umer Hayat (17541777) Chemical sciences Macromolecular and materials chemistry Engineering Fluid mechanics and thermal engineering Physical sciences Condensed matter physics thin film copper nanoparticles unsteady radial stretching surface partial slip shape factors viscous dissipation |
| status_str | publishedVersion |
| title | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| title_full | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| title_fullStr | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| title_full_unstemmed | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| title_short | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| title_sort | A numerical study on thin film flow and heat transfer enhancement for copper nanoparticles dispersed in ethylene glycol |
| topic | Chemical sciences Macromolecular and materials chemistry Engineering Fluid mechanics and thermal engineering Physical sciences Condensed matter physics thin film copper nanoparticles unsteady radial stretching surface partial slip shape factors viscous dissipation |