Thermal Stability Evaluation and Analyses of Bionic Drop-Jumping Superhydrophobic Copper Nanocone Structure Surface

The thermal stability of bionic superhydrophobic drop-jumping copper nanostructure surfaces is key to ensuring their safe use in the chip-cooling field. However, there is no report about the allowable heating temperature limit of such functional surfaces, and the condensate mode and wettability evol...

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Bibliographic Details
Main Author:	Qiulong Tang (22071242) (author)
Other Authors:	Yuan Tian (225002) (author), Rui Wang (52434) (author), Yanbin Shen (1691062) (author), Weibang Lyu (22071245) (author), Xuefeng Gao (1323462) (author)
Published:	2025
Subjects:	Biophysics Medicine Biotechnology Cancer Environmental Sciences not elsewhere classified Chemical Sciences not elsewhere classified Physical Sciences not elsewhere classified wettability evolution vary macroscopic water drops different temperatures indicates developing matchable low develop matchable low 45 ° c 300 ° c 150 ° c dependent performance stability superhydrophobic metal nanostructures condensate dynamics toward modifed copper nanostructures jumping removal functions heating temperature (< allowable temperature limit thermal stability understanding thermal stability evaluation condensate microdrop self temperature packaging technologies bionic superhydrophobic drop thermal stability superhydrophobic drop bionic drop condensate mode soldering technologies microdrop coalescence jumping function copper nanocones thiol bonds still unclear safe use remain stable progressive transition ordinary hydrophobicity near future morphology change latter rather helps deepen gradual dissociation generation high functional surfaces first time filmwise condensation far higher dropwise condensation dissociation degrees cooling field complete decomposition combined experiments bonded thiol
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Thermal Stability Evaluation and Analyses of Bionic Drop-Jumping Superhydrophobic Copper Nanocone Structure Surface

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