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large decrease » larger decrease (Expand Search), marked decrease (Expand Search), large increases (Expand Search)
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Elementary Steps in Olefin Metathesis: Nickelacyclobutanes via Cycloaddition to Nickel Carbenes
Published 2025Subjects: -
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Image 5_Using sodium glycodeoxycholate to develop a temporary infant-like gut barrier model, in vitro.pdf
Published 2025“…</p>Results<p>Our research demonstrates that GDC decreases Caco-2/HT29-MTX Trans-Epithelial Electrical Resistance (TEER) and increases paracellular permeability, without inflammation or cytotoxicity. …”
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The effect of HA digestion and HA replenishment alone or with CS on barrier function measured by TEER.
Published 2025“…TEER, transepithelial electrical resistance; PS, protaminesulfate; HA, hyaluronic acid; CS, chondroitin sulfate; T0, baseline; T3, 3 hours; T5, 5 hours; T7, 7 hours; T12, 12 hours; T24, 24 hours.…”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles
Published 2025“…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”