Showing 1 - 20 results of 9,962 for search '(((( via large decrease ) OR ( _ system decrease ))) OR ( a large decrease ))', query time: 0.42s Refine Results
  1. 1
  2. 2
  3. 3
  4. 4
  5. 5
  6. 6
  7. 7
  8. 8
  9. 9

    The introduction of mutualisms into assembled communities increases their connectance and complexity while decreasing their richness. by Gui Araujo (22170819)

    Published 2025
    “…(C) Mutualism also promotes an increase in network connectance when introduced into assembled communities, while stopping mutualistic interactions from entering an assembled system slowly decreases it. (D) As a result, the introduction of mutualistic interactions promotes a growth in complexity in communities where it was once established as low, while stopping the introduction of further mutualistic interactions causes a slight decrease in complexity. …”
  10. 10

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  11. 11

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  12. 12

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  13. 13

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  14. 14

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  15. 15

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  16. 16
  17. 17
  18. 18
  19. 19
  20. 20