Showing 501 - 520 results of 98,780 for search '(( 5 ((026 decrease) OR (a decrease)) ) OR ( 5 ((nm decrease) OR (nn decrease)) ))', query time: 1.34s Refine Results
  1. 501

    Dysregulated alternative splicing in DM1 hiNeurons at 10 DPI. by Mougina K. Eltahir (12988153)

    Published 2022
    “…(b) Scatter plots pertaining to Fig 5a show increased inclusion of <i>MBNL</i>1 e5 (top), <i>MBNL</i>2 e5 (bottom left) and <i>MBNL</i>2 e8 (bottom right) in DM1 hiNeurons. …”
  2. 502

    The decrease of C/EBPα protein during apoptosis involves induction of protein degradation and inhibition of transcription. by Meng Zhao (54299)

    Published 2009
    “…<p>(A) After pretreatment with 25 nM of NSC606985 or 0.5 µM of etoposide for 12 hours, NB4 cells were incubated with 10 µg/ml CHX for indicated hours. …”
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    Mechlorethamine gel causes epithelium thinning, epithelium-stroma separation, and decreased total stroma cell count. by Ana M. Sandoval-Castellanos (11611315)

    Published 2025
    “…<p>A) Epithelium thickness decreased, and B) the percentage of epithelium-stroma separation increased after NM exposure. …”
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    The MTT assay to determine decreases in residual cell viability in SK-N-BE2 and IMR-32 cells. by Nishant Mohan (474067)

    Published 2013
    “…As presented in the bar diagrams, combination of 50 nM LC3 shRNA plasmid and 25 µM GST in SK-N-BE2 cells while combination of 100 nM LC3 shRNA plasmid and 25 µM GST in IMR-32 cells showed the best synergistic efficacy, as determined by the combination index (CI) value, for the highest decrease in residual cell viability. …”
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    Fully Transparent and Rollable Electronics by Mallory Mativenga (1681909)

    Published 2015
    “…For handling purposes, carrier glass is used during fabrication, together with a very thin (∼1 nm) solution-processed carbon nanotube (CNT)/graphene oxide (GO) backbone that is first spin-coated on the glass to decrease adhesion of the CPI to the glass; peel strength of the CPI from glass decreases from 0.43 to 0.10 N/cm, which eases the process of detachment performed after device fabrication. …”
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