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ppm decrease » _ decrease (Expand Search), pa decreased (Expand Search), 026 decrease (Expand Search)
nn decrease » _ decrease (Expand Search), mean decrease (Expand Search), gy decreased (Expand Search)
nm decrease » _ decrease (Expand Search), we decrease (Expand Search), gy decreased (Expand Search)
a decrease » _ decrease (Expand Search), _ decreased (Expand Search), _ decreases (Expand Search)
ppm decrease » _ decrease (Expand Search), pa decreased (Expand Search), 026 decrease (Expand Search)
nn decrease » _ decrease (Expand Search), mean decrease (Expand Search), gy decreased (Expand Search)
nm decrease » _ decrease (Expand Search), we decrease (Expand Search), gy decreased (Expand Search)
a decrease » _ decrease (Expand Search), _ decreased (Expand Search), _ decreases (Expand Search)
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1421
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1422
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1423
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1424
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1425
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1426
Nitric Oxide Oxidatively Nitrosylates Ni(I) and Cu(I) <i>C</i>-Organonitroso Adducts
Published 2009“…[Me<sub>2</sub>NN]Cu(NCMe) reacts with 0.5 equiv of ArNO in ether to give the dinuclear adducts {[Me<sub>2</sub>NN]Cu}<sub>2</sub>(μ-η<sup>2</sup>:η<sup>1</sup>-ONAr) (<b>2a</b> and <b>2b</b>), which exhibit η<sup>2</sup> and η<sup>1</sup> bonding of the ArNO moiety with separate [Me<sub>2</sub>NN]Cu fragments possessing N−O distances of 1.375(6) Å (<b>2a</b>) and 1.368(2) Å (<b>2b</b>). …”
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1427
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1428
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1429
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1430
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1431
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1432
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1433
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1434
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1435
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1436
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1437
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1438
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1439
Fully Transparent and Rollable Electronics
Published 2015“…For handling purposes, carrier glass is used during fabrication, together with a very thin (∼1 nm) solution-processed carbon nanotube (CNT)/graphene oxide (GO) backbone that is first spin-coated on the glass to decrease adhesion of the CPI to the glass; peel strength of the CPI from glass decreases from 0.43 to 0.10 N/cm, which eases the process of detachment performed after device fabrication. …”
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1440