Showing 161 - 180 results of 29,112 for search '(( a large decrease ) OR ((( via ((point decrease) OR (a decrease)) ) OR ( ai use increased ))))', query time: 1.21s Refine Results
  1. 161

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  2. 162

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  3. 163

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  4. 164

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  5. 165

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  6. 166

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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