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Three-Tier Hierarchical Porous Structure with Ultrafast Capillary Transport for Flexible Electronics Cooling
Published 2025“…The proposed method resolves the challenge of fabricating a porous wick for flexible HP and VC, and it will open up a way for the cooling technique of flexible electronics.…”
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427
Three-Tier Hierarchical Porous Structure with Ultrafast Capillary Transport for Flexible Electronics Cooling
Published 2025“…The proposed method resolves the challenge of fabricating a porous wick for flexible HP and VC, and it will open up a way for the cooling technique of flexible electronics.…”
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428
Three-Tier Hierarchical Porous Structure with Ultrafast Capillary Transport for Flexible Electronics Cooling
Published 2025“…The proposed method resolves the challenge of fabricating a porous wick for flexible HP and VC, and it will open up a way for the cooling technique of flexible electronics.…”
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