Showing 141 - 160 results of 26,215 for search '(( via ((((mean decrease) OR (a decrease))) OR (larger decrease)) ) OR ( a large decrease ))', query time: 2.67s Refine Results
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    K-means++ clustering algorithm. by Zhen Zhao (159931)

    Published 2025
    “…Firstly, recursive feature elimination using cross validation (RFECV), maximum information coefficient (MIC), and mean decrease accuracy (MDA) methods were utilized to select population distribution feature factors. …”
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    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  17. 157

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  18. 158

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  19. 159

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  20. 160

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”