Showing 1 - 20 results of 4,024 for search '(( via large decrease ) OR ( a ((large decrease) OR (marked decrease)) ))', query time: 0.55s Refine Results
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    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  8. 8

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  9. 9

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  10. 10

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  11. 11

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
  12. 12

    High-Temperature Resistance, Lightweight, and Thermally Insulating Silica Aerogel via Doping Hollow Silica Nanoparticles by Mingyang Yang (1405321)

    Published 2025
    “…Furthermore, at 1100 °C, thermal conductivity decreased by 34.4%, and the density was only 242 kg/m<sup>3</sup>, the lowest density among SiO<sub>2</sub>-based aerogel composites. …”
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