Analytical Evaluation of Solder Stress in Electronic Packages Subjected to Random Vibrations
Electronic components, during assembly, transportation, and operation, are exposed to a diverse array of dynamic loads, encompassing high and low frequency vibrations, shock, impact, and most importantly, random vibrations. Such rigorous loading conditions necessitate the design of electronic compon...
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2023
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| Online Access: | http://hdl.handle.net/11675/10959 http://www.scopus.com/inward/record.url?scp=85171673483&partnerID=8YFLogxK |
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